| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of bonding failures of a bonding, which is performed with a bonding device by detecting a leak in a chucking pressure of suction unit, which sucks a lead frame on a bonding stage to perform the positioning of a chip on the lead frame, and to improve the yield of the bonding device. SOLUTION: A bonding device is so constituted that suction unit 116 vacuum- adsorbs the lower surface of a lead frame 101 through suction holes 119, and a chucking pressure generated by the vacuum suction of the unit 116 is measured by a pressure gate 8 at all time. A vacuum-suction detection of information is conducted by this pressure gate 8 and when the value of the detected information is a prescribed value, set previously in a memory within a control unit, of smaller, a bonding work is made to stop. |
