| 摘要 |
PROBLEM TO BE SOLVED: To obtain a hardened coating excellent in heat resistance, adhesion, resolution, electroless plating resistance, electrical characteristics, etc., and excellent also in moisture absorption resistance and PCT resistance particularly necessary for an IC package. SOLUTION: An epoxy compd. (a) having two or more epoxy groups in one molecule, a phenolic compd. (b) having a hydroxyl-contg. substituent and an unsatd. group-contg. monocarboxylic acid (c) are brought into a reaction in such a ratio that the amt. of the phenolic hydroxyl group of the component (b) is 0.2-0.6 equiv. per 1 equiv. epoxy group of the component (a) and the total amt. of the phenolic hydroxyl group of the component (b) and the carboxyl group of the component (c) is 0.8-1.3 equiv. per 1 equiv. epoxy group of the component (a) and the alcoholic hydroxyl group of the resultant reaction product is allowed to react with the anhydride group of a polybasic acid anhydride (d) in a ratio of 99:1 to 1:99 to obtain a photosensitive prepolymer (A). The objective alkali-developable photosetting-thermosetting compsn. contains the photosensitive prepolymer (A), a photosensitive (meth)acrylate compd. (B), a photopolymn. initiator (C), an epoxy resin (D) and a hardening catalyst (E). |
