METHOD AND DEVICE FOR PROCESSING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To adequately attain various processes of a substrate in a single chamber by an in-line system. SOLUTION: For processes at high-order process parts 32 to 34 having other process parts 31 to 33 as lower-order parts, the lower-order process parts 31 to 33 are nearly shielded by annular partition walls 7a to 7c having a downward flowing-down gap S, such as a processing material, etc., left with the internal surface of the chamber 1 around a support body 3 and the processes at the higher-order process parts 32 to 34 are performed for attaining the purpose.