发明名称 METHOD FOR SLICING INGOT
摘要 PROBLEM TO BE SOLVED: To provide a method for slicing an ingot for forming without cutout of a peripheral edge without executing a complicated step at a latch for transmitting a rotary force of a work to be ground after executing a slicing step. SOLUTION: In the method for slicing an ingot comprising the steps of setting a work 3 to be cut and formed by adhering a holding material 2 of an overall length of a columnar ingot 1 to a side face of the ingot 1 to a slicing unit, multiple dividing the work 3 in its lengthwise direction, and collecting disc-like works to be ground; a latch layer 7 directly adhered to the side face of the ingot 1 with a first adhesive having an adhesive strength sufficient to receive a rotary force by a grinding unit in a later grinding step, an intermediate layer 8 adhered to be superposed on the layer 7 with a second adhesive deteriorated in its adhesive strength from the first adhesive under predetermined conditions, and a holding material 2 superposed and integrated with a support layer 11 coupled to a support of the slicing unit are used.
申请公布号 JPH11286008(A) 申请公布日期 1999.10.19
申请号 JP19980088864 申请日期 1998.04.01
申请人 NIPPEI TOYAMA CORP 发明人 NISHI KENICHIRO;OKUYAMA TETSUO;NUKUI MITSURU;NAKAJIMA KAZUO;MURAI SHIRO;WADA TOYOHISA;NAKAGAWA TOMIO
分类号 B24B27/06;B24B7/17;B24B7/22;B24B37/00;B28D5/00;B28D5/02;B28D5/04;(IPC1-7):B28D5/04 主分类号 B24B27/06
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