发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is superior in fire-resistance and anti-tracking characteristics. SOLUTION: A layer of matrix comprising (a) epoxy resin, (b) a thermosetting resin component, wherein polycondensation product between bisphenol A and formaldehyde are the essential components with a bromine content of 5-15 wt.%, and (c) a hardened product of a thermosetting resin composition, wherein aluminum hydroxide is the essential component with Na2 O content which is 0.2 wt.% or less, is an insulating layer contacting an external layer conductor.
申请公布号 JPH11289166(A) 申请公布日期 1999.10.19
申请号 JP19980088698 申请日期 1998.04.01
申请人 HITACHI CHEM CO LTD 发明人 AOKI YASUYUKI;MURAI YASUHIRO;HANAWA AKINORI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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