发明名称 SURFACE PROTECTION LAYER FORMING METHOD FOR CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To accurately form an aperture part without deviations on a surface protective layer, for the purpose of connecting an electronic component, a connector and the like. SOLUTION: This surface protection layer 7 of a circuit substrate is formed while a part of a resist layer 3, to be used for formation of a circuit wiring pattern 2A, is used as a mask 5A for an aperture part 6 of the surface protective layer 7 used for the circuit wiring pattern 2A. An exposure mask 4 for exposing the resist layer 3 is formed in such a manner that the light transmittance of the part corresponding to the aperture part 6 of the surface protection layer 7 and the light transmittance of the part corresponding to the circuit wiring pattern 2A are different.
申请公布号 JPH11289151(A) 申请公布日期 1999.10.19
申请号 JP19980108673 申请日期 1998.04.03
申请人 NIPPON MEKTRON LTD 发明人 TANAKA HIDEAKI
分类号 G03F7/12;H05K3/28;(IPC1-7):H05K3/28 主分类号 G03F7/12
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