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发明名称
METHOD FOR FORMING MULTI METAL INTERCONNECTION LAYER OF SEMICONDUCTOR DEVICE
摘要
申请公布号
KR100223267(B1)
申请公布日期
1999.10.15
申请号
KR19960073605
申请日期
1996.12.27
申请人
HYUNDAI ELECTRONICS IND. CO.,LTD
发明人
JIN, SEONG-GON;KIM, CHUN-HWAN
分类号
H01L21/768;(IPC1-7):H01L21/768
主分类号
H01L21/768
代理机构
代理人
主权项
地址
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