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发明名称
STACKED CHIP PACKAGE HAVING A CHIP ON CHIP STRUCTURE
摘要
申请公布号
KR100223125(B1)
申请公布日期
1999.10.15
申请号
KR19960080987
申请日期
1996.12.31
申请人
SAMSUNG ELECTRONICS CO, LTD.
发明人
NAM, SEUNG JANG
分类号
(IPC1-7):H01L23/59
主分类号
(IPC1-7):H01L23/59
代理机构
代理人
主权项
地址
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