| 摘要 |
PROBLEM TO BE SOLVED: To realize a method of mounting semiconductor chips of the same size on both the surfaces of a circuit board respectively, without imposing a heavy load on the circuit board. SOLUTION: A solder resist or a base material itself 3c on a circuit board is set lower than a surface 3A of the circuit board, whereby a load required for the thermocompression mounting of a semiconductor chip (thermocompression of conductive connection material) is lessened. A processed conductive connecting material 4c is previously processed in feed form so as to be arranged only at a chip electrode 2B, and a wiring electrode 1B is fed onto the circuit board. |
