| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure, which is capable of preventing a contact failure from occurring between a ball grid array(BGA) package and a multilayer printed wiring board, even if an external shocks are given. SOLUTION: Bumps 7, formed of resin balls 7a each coated with a tin plating 7b, are arranged in an array. In this way, the resin balls 7a are each coated with a tin plating 7b for the formation of the bumps 7, and a BGA package 1 and a multilayer printed wiring board 3 are jointed together with the bumps 7, even when a product equipped with the BGA package 1 and the multilayer printed wiring board is dropped down to the floor and given external shocks, the resin balls 7a are elastically transformed by stresses applied to the bumps 7, so that the bumps 7 can be protected against fissures. As a result, contact failures caused by an external shock can be prevented. |
