发明名称 FITTING STRUCTURE OF POWER TRANSISTOR IN HEAT SINK
摘要 PROBLEM TO BE SOLVED: To increase a heat radiating area of a heat sink and enhance cooling efficiency by a method wherein a fitting part which projects frontwardly and rearwardly is provided in a base, and an inclined fitting face is formed on a side face of the fitting part. SOLUTION: A heat sink 1 comprises a base 2, a fin 3 and the like, and is formed integrally with a force-out material of aluminum. The base 2 displays a face-shaped configuration frontwardly and rearwardly, and also is comparatively thick, and a fitting part 4 of a shape close to a regular triangle is formed in a center part in a right and left direction in a fiontward projecting configuration. On both right and left side faces of the fitting part 4, a front end part is a face along a front-and-rear direction and displaying a face-shaped configuration for a right-and-left direction, and a part excluding the front end part is made as a pair of right and left power transistor fitting faces 5 inclined in the right-and-left direction. Further, a front end part (a top part) of the fitting part 4 is made as a printed substrate mounting face 6 (perpendicular to a front- and-rear direction) displaying a face-shaped configuration for the front. Thus, it is possible to increase a heat radiating area of the heat sink and increase cooling efficiency.
申请公布号 JPH11284110(A) 申请公布日期 1999.10.15
申请号 JP19980103586 申请日期 1998.03.30
申请人 ONKYO CORP 发明人 MORIYA SHINJI
分类号 H01L23/40;H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/40
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