发明名称 METHOD FOR BONDING LEAD WIRE
摘要 PROBLEM TO BE SOLVED: To enable the direct bonding of a mixture sintered body to a lead wire and to obtain bonding strength of the same degree as that of base metal by providing a section with a large proportion of electron conductive particles for the sintered body formed of a mixture of inorganic compound particles and electron conductive particles and bonding the lead wire to the section. SOLUTION: Low-melting inorganic compound particles 11 add high-melting electron conductive particles 12 in the state that the inorganic compound particles 11 makes up a large proportion are mixed, molded, and sintered to form a detecting electrode 1. A bonding material 10 is a mixture of inorganic compound particles and electron conductive particles and contains a large proportion of the electron conductive particles 12. The bonding material 10 is placed on the mixture and bonded by sintering to obtain a sintered body. A lead wire 9 is bonded to the bonding material section 10 of the sintered body by laser bonding. As laser bonding is performed on the bonding material section containing a large proportion of high-melting electron conductive particles, it is possible to eliminate the inconvenience that inorganic compound particles in the bonding material is melted by heat at the time of bonding and hinders bonding.
申请公布号 JPH11281608(A) 申请公布日期 1999.10.15
申请号 JP19980080682 申请日期 1998.03.27
申请人 AKEBONO BRAKE RES & DEV CENTER LTD 发明人 KOBAYASHI SHIGEAKI;NARITA HIDEKAZU
分类号 G01N27/30;G01N27/416 主分类号 G01N27/30
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