| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heat treating device capable of conveniently handling a heat treatment plate and reducing time and labor required for its manufacture. SOLUTION: A hot plate 1 is formed into an almost rectangular shape, slightly larger than a substrate S to be treated in a planar view and is provided with a base plate 11, a planar heater 12 laminated on the based plate 11 and a surface plate 13 laminated on the planar heater 12. The hot plate 1 is almost bisected equally by a straight line extending in a direction orthogonal to the longitudinal direction. On the upper surfaces of the respective division parts 13A and 13B of the surface plate 13, the plurality of almost spherical proximity balls 15 are respectively disposed. The substrate S to be treated is supported in a state which is separated from the upper surface of the surface plate 13 by a prescribed interval (d) by being mounted on the plurality of the proximity balls 15. |
