发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To enhance production efficiency of DRAMs without impairing a refresh characteristic by a method wherein, after a surface of a Si substrate forming a semiconductor device is exposed to electric charges particles, concentration of a metal element caused by the electric charge particles is measured on the surface of the Si substrate. SOLUTION: In each manufacture step, metal element contamination on a surface of an exposed Si substrate 11 for a test substrate 11 is inspected by all-reflection fluorescent X-rays analysis, an ICP mass analysis or the like in Fe, Al and Ca, and when a metal element concentration value reaches about 10<12> cm<-2> or more in the case of Fe or Al, and when about 3&times;10<11> cm<-2> or more in the case of Ca, a production line is stopped, and a cause of the metal element contamination is investigated to be removed. At that time, a management value is set so as not to deteriorate a refresh characteristic, and a strict management of the manufacture line of DRAMs is mitigated, and operability of the manufacture line is enhanced.
申请公布号 JPH11284145(A) 申请公布日期 1999.10.15
申请号 JP19980082304 申请日期 1998.03.27
申请人 FUJITSU LTD 发明人 NIWA HIROE
分类号 H01L21/302;H01L21/265;H01L21/3065;H01L21/8242;H01L27/108 主分类号 H01L21/302
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