发明名称 |
RADIATION SENSITIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To permit high resolution capable of matching quater-micron lithography using radiation by incorporating a specified coat film forming resin and an acid generator. SOLUTION: The radiation sensitive composition contains the coat film forming resin (a) and the acid generator (b), and the resin (a) is an alkali-soluble resin having phenolic hydroxyl groups or a resin having some of phenolic hydroxyl groups protected with acid decomposable groups and further one parts of the phenolic hydroxyl groups are cross-linked with each other to form structural units each represented by formulae I and II in which X is a divalent bonding group; and Y is a trivalent bonding group. The alkali-soluble resin having the phenolic hydroxyl groups can be embodied by a poyvinylphenol or novolak resin or their derivatives or the polyvinylphenol resin. The polyvinylphenol derivatives are, such as ones obtained by polymerizing hydroxystyrene or copolymerizing the hydroxystyrene with other various kinds of vinyl monomers. |
申请公布号 |
JPH11282164(A) |
申请公布日期 |
1999.10.15 |
申请号 |
JP19980079489 |
申请日期 |
1998.03.26 |
申请人 |
MITSUBISHI CHEMICAL CORP |
发明人 |
NIIMI TAKAAKI;FUJITA ATSUSHI |
分类号 |
H01L21/027;G03F7/004;G03F7/039;(IPC1-7):G03F7/039 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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