| 摘要 |
<p>PROBLEM TO BE SOLVED: To simplify taking-out of a product, clean a runner, a gate, etc., readily and enable good automatic operation by providing a holding plate to one side of mold of comprising a stationary mold and a movable mold, and forming a runner groove and a gate in the other side mold to a junction surface with a surface at the other side of the holding plate. SOLUTION: A resin sealing device 100 includes a movable mold 102 and a stationary mold 104 and is provided with a mold 108 in which a cavity 106 can be formed and a holding plate 112 which holds a substrate 110 comprising a semiconductor element of a ball grid array. The holding plate 112 is provided to the side of the stationary mold 104 and both a runner groove 114 and a gate 116 are formed facing the holding plate 112 at the side of the movable mold 102. A holding plate is provided to one mold and residue such as cull (resin standing in the gate 116) can be pushed out from the runner groove 114 surely, and be cut off clearly, thus a runner groove, a gate, etc., can be cleaned readily.</p> |
