| 摘要 |
<p>PROBLEM TO BE SOLVED: To stably and surely grasp a semiconductor wafer at the center position of a rotating table by a mechanical force. SOLUTION: This single-wafer processing type spin drying device is provided with a rotating cylinder 3 for rotating a table drive, a nozzle shaft 10, shaft elevating mechanisms 17 to 19, a plurality of chucking shafts 14 and a plurality of chucking pawls 16 which respectively have a chucking part, and the device is constituted into a structure, wherein when the shaft 10 is moved upward, the shafts 14 are extended in the outer peripheral direction of a rotating table 2 to rotate the chucking pawls 16, to hold the outer peripheral edge of a semiconductor wafer 1 by the chucking parts provided on the points of the pawls 16, the chucking shafts 14 are pulled in the central direction of the table 2 when the shaft 10 has been lowered to its former position for turning the pawls 16 in the opposite direction, and the grasp of the outer peripheral edge of the wafer 1 by the chucking parts is released.</p> |
