| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bybrid module and a method for manufacturing the same excellent in soldering a circuit component and reliability. SOLUTION: After a given number of ceramic green sheet with a conductor 111 for wiring in its inner and a surface layer formed by an Ag conductor material is laminated and baked, a ceramic multilayer circuit board 11 is made by forming and baking a Cu conductive material film 113 only on a soldering region (land 112) of the conductor 111 for wiring on the surface layer and a hybrid module is manufactured by soldering and mounting the circuit component on the circuit board 11. The method for manufacturing makes it possible to prevent oxidation of the Cu conductive material since the Cu conductive material is baked in a neutral or reduction atmosphere after the Ag conductive material is baked in an atmosphere of neutral or oxidation. The simultaneous baking of the conductor 111 for wiring of the inside and surface layer makes it possible to reduce man hour and cost.</p> |
