FORMING METHOD AND CONNECTING METHOD OF BUMP ARRAY

摘要

PROBLEM TO BE SOLVED: To realize a method of forming a bump array which can be efficiently connected to a pad array. SOLUTION: A casting board 1 with grooves 2 provided to its surface is formed. Then bump main bodies 3 made of binder-free conductive paste is embedded in the grooves 2 and formed. Next, the bump main bodies 3 are burned to have their volume shrunk. Then, solders 4 are each provided to the bump main bodies. Lastly, the solders 4 are changed in shape through surface tension, whereby the upsides of the solders 4 are set higher than the opening surfaces of the grooves 2.