| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed circuit board with small dislocation, by preventing defects in formation like a shortage in resin, voids or wrinkles in copper at a board edge in a multi-layer bonding step. SOLUTION: At least a sheet of prepreg is provided between at least two boards having a circuit on the surface, and the members are fixed temporarily. After a copper foil is provided through the prepreg or may not provided, multi- layer base board materials are laminated with a plurality of metallic boards and bonded by heating under pressure to form a multi-layer printed wiring board. In this case, a metallic plate 4 with a large size covering the temporarily fixing part and a metallic plate 8 with a small size hardly covering the temporarily fixing part are alterately laminated as the metallic plates when the multi- layer base board materials are laminated with the metallic boards. |
