发明名称 BONDING TOOL
摘要 <p>A bonding tool used in a bonding apparatus for bonding, for example, pellet and leads of a lead frame including a tool attachment part to which a tool member is mounted. The tool member has four inclined surfaces, and the tool attachment part includes two fixed guide members and two detachable guide members fastened to the tool attachment part by bolts. Inclined surfaces that position two adjacent inclined surfaces of the tool member are formed on the fixed guide members, and inclined surfaces that position the other two inclined surfaces of the tool member are formed on the detachable guide members. The tool member is mounted on and dismounted from the tool attachment part by merely removing the detachable guide members.</p>
申请公布号 KR100225568(B1) 申请公布日期 1999.10.15
申请号 KR19960040473 申请日期 1996.09.18
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 ICHIGAWA, SHIGAERU
分类号 H01L21/60;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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