| 摘要 |
PCT No. PCT/CH94/00055 Sec. 371 Date Dec. 20, 1994 Sec. 102(e) Date Dec. 20, 1994 PCT Filed Mar. 14, 1994 PCT Pub. No. WO94/22110 PCT Pub. Date Sep. 29, 1994The present invention concerns a method of manufacture a method of manufacturing a card wherein there is supplied a compressible positioning structure (6), at least one electronic element (8) and a binder (12). The electronic element is positioned in a manner such that it is superposed onto the compressible positioning structure. In a first case, the binder (12) is supplied in liquid form. In another case, such binder is supplied in the form of a solid sheet, which is subsequently at least partially melted by applying energy. With the help of a press, pressure is applied to the various elements as supplied. The electronic element (8) then penetrates the positioning structure (6) and the binder spreads out so as to coat the electronic element (8). Finally there is obtained following solidification a solid card. |
