PROCESS FOR THE PRODUCTION OF SUBSTRATE FOR PRINTED WIRING

摘要

The process comprises the production of a substrate for printed wiring, which has high thickness accuracy and permits the formation of a printed wiring network by most general methods such as wet electroless copper plating without impairing the excellent properties of an inorganic continuous porous material such as a low coefficient of thermal expansion, high heat dissipation properties and high machinability, the process comprising wrapping a thick plate-like inorganic continuous porous material (I) with a cloth or paper (IV), impregnating the wrapped inorganic continuous porous material (I) with a thermosetting resin (II) under reduced pressure, curing the thermosetting resin to form a composite material(III), and slicing the composite material (III) into substrates having a predetermined thickness.