摘要 |
A cutting oil comprising a polyether compound of formula (1): R1O(EO)m(AO)nR2, wherein R1 and R2 may be same or different and each represents a hydrogen atom or a hydrocarbon group having 1 to 24 carbon atoms provided that at least one of R1 and R2 is a hydrocarbon group, EO and AO represent an oxyethylene group and an oxyalkylene group having 3 or 4 carbon atoms, respectively, and m and n are each 1 to 50, provided that the sum of m + n is 4 to 100, a cutting oil composition comprising the cutting oil and an abrasive, a cutting method using the composition, a method for cleaning a wafer which comprises washing with water a wafer provided by cutting an ingot with a wire saw, using the composition, heating the resultant drainage water to a temperature higher than that of the compound of formula (1) contained in the drainage water, to thereby separate the drainage water into an oil phase and a water phase, and separating the oil phase from the drainage. By the method, excellent dispersibility of an abrasive, including that in redispersing after the occurrence of settling, excellent cutting properties and excellent workability can be achieved, and also a product obtained by cutting can be cleaned with ease after cutting.
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申请人 |
KAO CORPORATION;HASHIMOTO, JIRO;HAGIHARA, TOSHIYA;NISHIMOTO, KAZUHIKO |
发明人 |
HASHIMOTO, JIRO;HAGIHARA, TOSHIYA;NISHIMOTO, KAZUHIKO |