| 发明名称 |
METHOD AND APPARATUS FOR WAFER PROCESSING, AND METHOD AND APPARATUS FOR EXPOSURE |
| 摘要 |
An apparatus for processing wafers (R) comprises wafer transportation means (16) for transporting received wafers from the outside in order to subject them to a predetermined processing. Receiver parts (12) and (13) are provided for the wafer transportation means (16) to receive wafers (R) from the outside.
|
| 申请公布号 |
WO9952141(A1) |
申请公布日期 |
1999.10.14 |
| 申请号 |
WO1999JP01703 |
申请日期 |
1999.04.01 |
| 申请人 |
NIKON CORPORATION;HIRAKAWA, SHINICHI |
发明人 |
HIRAKAWA, SHINICHI |
| 分类号 |
B65G49/07;G03F7/20;H01L21/677;H01L21/68;(IPC1-7):H01L21/68;H01L21/30 |
主分类号 |
B65G49/07 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
