| 摘要 |
<p>A cooling device of multispindle servo-amplifier capable of reducing the size, weight, and cost of a heat sink, wherein a multispindle servo-amplifier having a plurality of motor driving servo-amplifiers (S) with at least one power semiconductor device (1) thereon being provided with a plurality of servo-amplifiers (S) on one cooling heat sink (H), the heat sink (H) setting the size and weight thereof so that it can accommodate an output less than the sum of each of the continuous rated outputs from the plurality of servo-amplifiers (S), whereby heat from the servo-amplifiers being operated at continuous rated outputs can be radiated from the heat sink at these areas where the servo-amplifiers being operated at outputs less than the continuous rated outputs are positioned, and the overall size, weight, and cost of the heat sink can be reduced remarkably.</p> |
