| 摘要 |
<p>A small-sized low-cost circuit board for mounting integrated circuits, which includes bypass capacitors and efficiently reduces variations in source voltage in high-speed switching operation. The circuit board comprises at least one bypass capacitor (C) formed of two electrode layers (2, 2') with an interleaving dielectric layer (1), a printed-circuit board (3), and two or more via holes (4, 4') or openings (9, 9') for electrically connecting between the bypass capacitor and the printed-circuit board. The printed-circuit board is stacked on the bypass capacitor, and one electrode (5) of the printed-circuit board is connected with the grounding electrode layer (2) of the bypass capacitor through the grounding via hole (4) or through a bonding wire (10) in the opening (9). The other electrode (5') of the printed-circuit board is connected with the high-potential electrode layer (2') of the bypass capacitor through the grounding via hole (4') or through a bonding wire (10') in the opening (9').</p> |
