| 摘要 |
<p>A fluid flow plate (400) is preferably formed with conductive member(s) (414) and non-conductive material(s) (416). The conductive member(s) (414) and/or the non-conductive material(s) (416) form portion(s) of land(s) (412) and/or flow channel(s) (404) on face(s) (402) of the plate (400). The flow channel(s) (404) pass between and/or among the land(s) (412). The conductive member(s) (414) form electrical path(s) between, among, about and/or around position(s) on the face(s) (402) of the plate (400). The non-conductive material(s) (416) can form brace(s) for, and/or seal(s) with, portion(s) of the flow channel(s) (404). The non-conductive material(s) (416) can form portion(s) of a periphery (424) of the face(s) (402) of the plate (400), and/or portion(s) of any appropriate geometric feature(s) for the plate (400). The non-conductive material(s) (416) can be injection-molded. The non-conductive material(s) (416) can form means (2272) for aligning the fluid flow plate (400) with an adjacent plate (2500). The non-conductive material(s) (416) can form means (2474) for maintaining clamping pressure on a component (2450) between the fluid flow plate (400) and an adjacent plate (2500). The conductive member (414) can form a flow channel section (404) on one face (402) that forms a land portion (412') on an opposite face (402') of the plate (400).</p> |
