发明名称 Verfahren zum Verbinden zweier mit Leiterbahnen versehener Bänder und Magnetkopf mit zwei nach diesem Verfahren miteinander verbundenen Bändern
摘要 A method of connecting two strips (1, 3) each provided with a conductor pattern, an insulating coating (9, 11) and a set of free conductor portions (5a, 7a) of the conductor pattern, which free conductor portions are disposed outside the coating. The strips are positioned in such a manner relative to one another that the one set of free conductor portions faces the other set of free conductor portions and the coatings overlap one another at least partly. After this, the two strips are pressed against one another and the one set of free conductor portions is soldered to the other set of free conductor portions. However, before the strips are pressed against one another an adhesive is applied to at least one of the coatings at such a location that after positioning of the strips the adhesive is situated in an overlapping area between the coatings. The adhesive is used for adhering the coatings to one another while the strips are pressed against one another and the one set of free conductor portions is soldered to the other set of free conductor portions. <IMAGE>
申请公布号 DE69511928(D1) 申请公布日期 1999.10.14
申请号 DE1995611928 申请日期 1995.04.18
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 VERVOORT, MARTINUS ANTONIUS FRANCISCUS
分类号 G11B5/31;H01R12/61;H01R43/02;H05K3/30;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):H01R9/07 主分类号 G11B5/31
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