WIRE BOND ATTACHMENT OF A INTEGRATED CIRCUIT PACKAGE TO A HEAT SINK

摘要

A thermally conductive mounting flange of an IC package is placed directly o n a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposin g sides of the package are positioned over corresponding conductive areas form ed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secur e the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.