发明名称 |
Heat spreader mounting pad configurations for laser soldering |
摘要 |
<p>There is disclosed herein a printed circuit board onto which an electronic component heat spreader (52) may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.</p> |
申请公布号 |
EP0949853(A1) |
申请公布日期 |
1999.10.13 |
申请号 |
EP19990302404 |
申请日期 |
1999.03.29 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
SINKUNAS, PETER JOSEPH;BAKER, JAY DEAVIS;GLOVATSKY, ANDREW ZACHARY |
分类号 |
H05K1/02;H05K1/11;H05K3/34;H05K3/42;H05K7/20;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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