发明名称 |
Method and apparatus for facilitating detection of solder opens of SMT components |
摘要 |
A split-pad land pattern configured to facilitate electrical testing of an interconnection between a single electrical contact of a surface mount technology component and a printed circuit board. The split-pad land pattern comprises at least one split mounting pad including at least a first and second mounting pads coupled to a single electrical contact. The mounting pads are further coupled to corresponding access pads so that a first access pad is coupled to the first mounting pad while a second access pad is coupled to the second mounting pad. Electrical testing of the single electrical contact is possible through the completed circuit between the two access pads.
|
申请公布号 |
US5966020(A) |
申请公布日期 |
1999.10.12 |
申请号 |
US19960741053 |
申请日期 |
1996.10.30 |
申请人 |
INTEL CORPORATION |
发明人 |
RAMPONE, THOMAS;ARRIGOTTI, GEORGE |
分类号 |
G01R31/04;H05K1/02;H05K1/11;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|