| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to prevent the generation of such a trouble as to say that the rise in the probe pressure of probes is not stopped even if the probe pressure becomes excessive by a failure in protective diodes due to one part of electrode pads at the time of an adjustment of the probe pressure for making an operation check measurement (2PC) of a semiconductor device before mounting a chip. SOLUTION: Electrode pads 3 for element evaluation measurement (1PC) are provided at the four corners of a chip 1. Probes are respectively made to face electrode pads 2 for operation check measurement and the pads 3 and while the probe pressure of the probes is gradually increased, the probes are applied to all of the electrode pads 2 and when energization of protective diodes to correspond to the probes 2 is possible, or when an evaluation measurement of a semiconductor device through the pads 3 can be made, the rise in the probe pressure is stopped and in the state, an operation check measurement of the device is made.</p> |
