发明名称 |
Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads |
摘要 |
In a semiconductor package which includes a plurality of semiconductor chips of different kinds, some of the chips are bonded to die bonding pad by means of a conductive adhesive, while the other chips are bonded by means of a non-conductive adhesive that contains highly insulating beads. Encapsulation of the package is by a molding compound. A nitride film or an organic insulating film is disposed on a back side of the chips bonded by the non-conductive adhesive to improve the withstand voltage between these chips and the die pad. |
申请公布号 |
US5965947(A) |
申请公布日期 |
1999.10.12 |
申请号 |
US19970914270 |
申请日期 |
1997.08.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
NAM, SHI-BAEK;MOK, SEUNG-KON;KWON, DAE-HOON |
分类号 |
H01L23/52;H01L21/52;H01L21/58;H01L21/60;H01L25/07;H01L25/18;(IPC1-7):H01L23/52;H01L23/34;H01L23/28 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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