发明名称 PACKAGING STRUCTURE OF SURFACE MOUNTED PART
摘要 PROBLEM TO BE SOLVED: To provide a packaging structure of a surface mounted part in which shipment of a product can be carried out simply, the packaging state is simple, a special packaging machine is not required, the packaging work can be carried out without accompanying excessive processing expense and the material expense, the residual hoop after the automatic insertion is a bonding sheet only and the amount of refuse is small to make the friendly environment. SOLUTION: In the packaging structure of a surface mounted part (a surface mounted switch) A, a number of surface mounted switches A are provided on an insulated sheet 1, and the surface mounted switches A are separated into the given number groups and carried on a bonding sheet 26, and the surface mounted switches A are carried in the above order, and the insulated sheet 1 is cut off for respective surface mounted switches A of given numbers in the state of sticking the bonding sheet 26 on the back side of the insulated sheet 1 on which a number of surface mounted switches A are provided.
申请公布号 JPH11278583(A) 申请公布日期 1999.10.12
申请号 JP19980103993 申请日期 1998.03.31
申请人 OMRON CORP 发明人 TSUGII HIDESHI;TOMIZU MOTOYUKI
分类号 B65D85/86;H05K13/02 主分类号 B65D85/86
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