发明名称 |
Electrical and electronic components made of a polyamide composition |
摘要 |
The invention relates to electrical and electronic components made of a polyamide composition and possessing an improved resistance under soldering conditions, particularly when the surface mounting technique is used. This is achieved by using a polyamide composition whose main chain essentially consists of units derived from aliphatic dicarboxylic acids and diamines or alpha , omega -amino acids, and in which 1-40% of the chain units are derived from 1,6-cyclohexanedicarboxylic acid and an aliphatic diamine, or from 1,4-cyclohexanediamine and an aliphatic dicarboxylic acid. As a result, the temperature at which blisters are formed during soldering by the infrared method is 20-30 DEG C. higher than in the case of the homo-polyamide.
|
申请公布号 |
US5965689(A) |
申请公布日期 |
1999.10.12 |
申请号 |
US19980044133 |
申请日期 |
1998.03.19 |
申请人 |
DSM N.V. |
发明人 |
KONING, CORNELIS E.;KNAPE, PETRONELLA M.;LEEUWENDAL, ROBERT M.;SCHIFFER, JOSEFINA M. A. |
分类号 |
C08G69/26;C08G69/36;H01B3/30;(IPC1-7):C08G69/26;C08G73/00 |
主分类号 |
C08G69/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|