| 摘要 |
Carrier tape (12) is disclosed which absorbs kinetic energy and protects the leads (34, 34') of electronic circuit components (32) from bending or being otherwise damaged in an industry drop test. The components (32) are supported in pockets (22) by platforms (40) which are free of ridges extending above the bottoms of the components (32). The free ends of the leads (34) simultaneously engage ramp portions (42) of the pocket sidewalls (24) which are inclined upwardly and outwardly from the pocket bottoms (26) to center the components (32) in the pockets (22). The pockets (22) are of a size to sandwich the components (32) against the platforms (40) when the carrier tape (12) is in a stacked arrangement such as by being wound on a reel (58). The pocket bottoms (26) include undercuts (54) allowing the pocket bottoms (26) in an upper layer to sandwich two different components (32) in two circumferentially adjacent pockets (22) of the lower layer. In other forms, the pockets (22) include protrusions (60) having abutment surfaces (64) which abut with the cover tape (56) for clamping the components (32) against the platforms (40) of the lower layer and which deflect the platforms (40) of the upper layer for raising the components (32) against the cover tape (56).
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