| 摘要 |
PURPOSE: To improve the reliability of a semiconductor device by altering the disposition of a pin mark and hence by removing the thin part of the resin which is easily cut out from the periphery of a screw hole. CONSTITUTION: Pin marks to be formed by a pressing pin for pressing a radiating plate 1 to the mold surface are disposed on the inner periphery of screw holes 4 provided at the holes 4 at both short sides 21 of the plate 1. The pin marks 5a, 5d of the side in which a force for tearing off resin 3 is operated are shifted or removed reversely to the rotating direction with respect to the rotating direction to clamp a mounting screw. |
