| 摘要 |
Particles counts and concentrations are reduced from the backside of a substrate, such as a semiconductor wafer or flat panel display with the invention, to improve precision and uniformity in subsequent operations, including lithography operations. A semiconductor substrate is placed on a chuck (10) in a track system (30), such as a resist coater, a developer, or other form of spin coater. The substrate is processed accordingly to conventional practice and the substrate is removed. The chuck is then cleaned by dispensing a solvent, for example using EGMEA or PGMEA, through a dispense nozzle (38) of the system. Alternatively, or additionally, a brush (36) or sponge which is at least partially saturated with a solvent (39) is moved across the chuck to remove particles. The chuck cleaning can occur between every wafer, every wafer lot, or less periodically, such as between shifts, as the chuck particle accumulation dictates.
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