| 摘要 |
PROBLEM TO BE SOLVED: To reduce the consumption of the resin molding material of electronic parts remarkably and to obtain good moldability. SOLUTION: In a plastic molding apparatus in which cavities 6, 7 are formed in an upper mold 3 and a lower mold 4, a thermosetting resin 8 is melted in the pot 1 of a resin molding mold in which the pot 1 is formed in the upper mold 3 or the lower mold 4, and the resin 8 is pressurized by a plunger 2 and made to flow to be packed into the cavities 6, 7 for molding, a projected step part having step parts is formed in the head part of the plunger 2. |
