| 摘要 |
A slurry dispenser dispensing slurry by a rotating wheel is provided in a chemical-mechanical polishing process used in manufacturing integrated circuits. The slurry dispenser is driven by a variable speed motor at a predetermined speed empirically determined to dispense a desired amount of slurry. A groove is provided along the circumfrence of the rotating wheel to control the width of the spray. At the same time, walls in the housing of the slurry dispenser restrict the angle of the spray. The slurry dispenser can be constructed out of material chemically inert with respect to the slurry.
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