发明名称 |
Wafer level burn-in system |
摘要 |
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.
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申请公布号 |
US5966022(A) |
申请公布日期 |
1999.10.12 |
申请号 |
US19960748517 |
申请日期 |
1996.11.08 |
申请人 |
W. L. GORE & ASSOCIATES, INC. |
发明人 |
BUDNAITIS, JOHN J.;LEONG, JIMMY |
分类号 |
G01R31/26;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/326;H01L21/66;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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