发明名称 ADHESIVE SHEET, METALLIC FOIL WITH ADHESIVE, MULTILAYER BOARD COVERED WITH METALLIC FOIL, AND LAYERED BOARD AND PRINTED CIRCUIT BOARD COVERED WITH METALLIC FOIL
摘要 PROBLEM TO BE SOLVED: To prepare the subject sheet having little deterioration of insulating properties with the laps of time and capable of being used for producing multilayer board covered with a metallic foil by compounding a thermosetting resin and an electrically insulating whisker as essential components. SOLUTION: This sheet is obtained by forming an adhesive comprising (A) a thermosetting resin (e.g. a bisphenol A novolak-type epoxy resin) and (B) an electrically insulating whisker as essential components into a sheet, and has a melt viscosity in the range of 100-1000 Pa.s. Further, the component B preferably has an average diameter of 0.3-3.0μm, an average length of 3-20μm and the maximum length of 50μm, and, for example, aluminum borate whisker is used for the purpose.
申请公布号 JPH11279493(A) 申请公布日期 1999.10.12
申请号 JP19980087627 申请日期 1998.03.31
申请人 HITACHI CHEM CO LTD 发明人 TANABE TAKAHIRO;KOBAYASHI KAZUHITO;TAKAHASHI ATSUSHI;KAMISHIRO YASUSHI;MORITA KOUJI
分类号 H05K1/03;B32B15/08;C08J5/18;C09J7/00;C09J7/02;C09J163/00;C09J179/04;(IPC1-7):C09J7/00 主分类号 H05K1/03
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