发明名称 |
ADHESIVE SHEET, METALLIC FOIL WITH ADHESIVE, MULTILAYER BOARD COVERED WITH METALLIC FOIL, AND LAYERED BOARD AND PRINTED CIRCUIT BOARD COVERED WITH METALLIC FOIL |
摘要 |
PROBLEM TO BE SOLVED: To prepare the subject sheet having little deterioration of insulating properties with the laps of time and capable of being used for producing multilayer board covered with a metallic foil by compounding a thermosetting resin and an electrically insulating whisker as essential components. SOLUTION: This sheet is obtained by forming an adhesive comprising (A) a thermosetting resin (e.g. a bisphenol A novolak-type epoxy resin) and (B) an electrically insulating whisker as essential components into a sheet, and has a melt viscosity in the range of 100-1000 Pa.s. Further, the component B preferably has an average diameter of 0.3-3.0μm, an average length of 3-20μm and the maximum length of 50μm, and, for example, aluminum borate whisker is used for the purpose.
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申请公布号 |
JPH11279493(A) |
申请公布日期 |
1999.10.12 |
申请号 |
JP19980087627 |
申请日期 |
1998.03.31 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TANABE TAKAHIRO;KOBAYASHI KAZUHITO;TAKAHASHI ATSUSHI;KAMISHIRO YASUSHI;MORITA KOUJI |
分类号 |
H05K1/03;B32B15/08;C08J5/18;C09J7/00;C09J7/02;C09J163/00;C09J179/04;(IPC1-7):C09J7/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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