| 摘要 |
PCT No. PCT/DE96/00993 Sec. 371 Date Jun. 10, 1998 Sec. 102(e) Date Jun. 10, 1998 PCT Filed Jun. 5, 1996 PCT Pub. No. WO97/02321 PCT Pub. Date Jan. 23, 1997The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.
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