| 摘要 |
The invention relates to a method and a device for treating wafers presenting components during thinning of the wafer, separation of the components and the intermediate production steps. The front of the wafer having the components is coated with a layer which remains on the front side of the wafer after thinning, the other production steps and separation. The advantage of the invention is that it effectively protects the components during thinning, separation and other production steps and allows for the high-density arrangement on the wafer of components having small dimensions and permits very thin components. |
