CLOTH, METHOD AND DEVICE FOR POLISHING MIRROR FINISHED SURFACE OF SEMI-CONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To reduce the unevenness of a polishing margin due to the generation of warping and waving of a wafer itself by inserting a hard plastic sheet between a surface layer of a porous soft body and a lower layer of a rubber elastic body in the condition that the hard plastic sheet is adhered to the rubber elastic body of the lower layer. SOLUTION: A polishing cloth 20 to be used for polishing a surface of a semi-conductor wafer W is formed by inserting a hard plastic sheet 22 between a surface layer 21 of a porous soft body and a lower layer 23 of a rubber elastic body in the condition that the hard plastic sheet 22 is adhered to the rubber elastic body of the lower layer 23. Transmission of the wave of the rubber elastic body of the lower surface 23 to be generated by the horizontal force to be generated at the time of polishing to the surface layer 21 is restricted by the rigidity of the hard plastic sheet 22 of the intermediate layer. Furthermore, unevenness of the polishing margin due to the curve and wave of the wafer W itself is relaxed, and the semi-conductor wafer W having a desirable degree of flatness and surface roughness is thereby manufactured.