| 摘要 |
PROBLEM TO BE SOLVED: To shorten forming cycle and ensure high quality and high productivity by reducing a wire sweep WSP and improving the charging rate of a resin. SOLUTION: A gate 118 for encapsulating with a resin 106 into a cavity 112 is formed near two adjacent corners of the cavity 112, the encapsulating direction of the resin 106 into the cavity 112 from the gate 118 is directed toward the center of a substrate 102 to enable the resin encapsulating apparatus of a semiconductor element with high quality and high productivity. This greatly improves the charging rate (T/F speed) of the resin 106 and improves the reduction of the wire sweep WSP at the same time, thereby providing superior effect of reducing the mean cycle owing to the improved the product quality and high speed charging. |
