| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can deal with high-density mounting in multi-pin structure, and a producing method therefor. SOLUTION: A ball terminal 3 is electrically adhered to a pad 2, which is arranged at a peripheral part on the front side of a semiconductor chip 1, at the interval of two terminals, and a TAB 4 is electrically adhered at the interval of two TAB to the pad 2, to which this ball terminal 3 is not adhered. The TAB 4 is U-shaped along with the side face of the semiconductor chip 1, its terminal is adhered and fixed to the peripheral part of a rear side, and the ball terminals 3 arranged on the rear side are respectively electrically connected and mounted onto the terminals of the TAB 4. Thus, since the ball terminals 3 connected to the respective correspondent pads 2 are arranged on both sides of the semiconductor chip 1, the ball terminals 3 can be respectively functioned as terminals for connection to the outside. |
