| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an interconnector having a structure contributive to high productivity. SOLUTION: This interconnector is constituted of a substrate 11 which has a first and a second face and is made of translucent resin, translucent conductor layers 21, 22 formed on the substrate 11, and a conductive pillar 31 which passes through the substrate 11 to connect the conductor layers 21, 22 and which includes a carbide of the substrate constituting resin. It would be acceptable to locate a reflector 51 on the substrate 11 side of the conductor layer 22. Due to this structure, interlayer connections to any conductor layer 21, 22 can be collectively formed at the same time.</p> |
