| 摘要 |
PROBLEM TO BE SOLVED: To provide a correcting method and the correcting device for bonding coordinates, which prevent generation of the large amount of the semiconductor elements in the defective connection structure. SOLUTION: In the method for correcting the wire bonding coordinates of a wire bonder which includes the lead frame having a pad and a lead, a camera 610 which photographs the images of the pad and the lead, a monitor 620 which outputs the image photographed with the camera 610, and a memory 650 which stores the coordinates of the pad and the lead to be wire-bonded, the following steps are included. In the first stage, the coordinate data for the objective bonding points on the pad and the lead are stored in the memory part 650 of a wire bonder. In the next step, wire bonding is performed. In the next step, the allowable correction range for the bonding point of a capillary is set. In the next step, the objective bonding point and the capillary compare the error value between the actual bonding points in bonding with the torelance value. In the final step, the wire bonding is made to continue when the error value is smaller than the torelance value. |
